Specialty Adhesives, Coatings, TIMs Materials for Ultimate Device Reliability
LED DIE-ATTACH: • Hyper-Conductive Epoxies • Insulating Thermal Adhesives
SUB-MODULE MOUNTING • Pressure-Sensitive Film Adhesives • Compressible Phase Change Pads
MODULE-TO-HEATSINK INTERFACE • Pressure-Sensitive Film Adhesives • Compressible Phase Change Pads • Thermal Greases & Gels
COOL-BOND®: High-Performance Thermal Adhesives
COOL-GREASE®: Industry Proven Thermal Grease
COOL-GEL® In-Situ Curing Thermal Gel
COOL-CLAD™ IMTS
COOL-PREG™ Low Pressure Rapid Curing Laminat
• CPU to Heatsink • Compressible Phase Change Pads • Thermal Greases & Gels • Pressure Sensitive Film Adhesives • Compressible Phase Change Pads • Thermal Greases & Gels • Memory Module to Heatspreader • Pressure Sensitive Thermal Pads • Compressible Thermal Pads • Components to Casting Heatsink • Compressible Gap Filling Pad
High Concuctivity • Films & Pates • High Temperature • Flexible & Compliant • Thermal Interface Materials • Compressible Gap-Pad Films • Compressible Phase Change Pads • Greases & Gels • Thin Bondline